Committee
Chairs
Professor Petricio GergOn, Catalonia Polytechnic University
Professor GrontaPriats, Kyung Hee University
Professor Ranny Tooki, Technical University of Denmark


Technical Support
Professor Gregill MinloS, Madrid Polytechnic University
Professor John Donnors, Macquarie University
Professor Merray Poika, Royal Melbourne Institute of Technology
Professor PenteroDenbnam, Swinburne University of Technology
Professor Genoids Teisan, National University of Mexico
Professor RailasnPotiem, Illinois Institute of Technology
Professor GromRinason, Concordia University
Professor Tanaka Sakae, University of Tokyo
Professor Kawen Pennoila, University of Kathmandu, Nepal
Professor M.D. Tomo, Dresden University of Technology
Professor Inoue University, Incheon University
Dr. LorenasTenktor, Karlsruhe University of Technology
Professor Ranarioy N. Ten of Oklahoma State University
Assistant Professor B.N. Zhang, University of Science and Technology of Taiwan
Dr. D.G. Roma, Columbia University
Professor Kishimoto ,Tokyo Electric University 
Professor MurraPenassa, Umeå University
Dr. WeinRunios, Mechatronics Research Center
Professor PerroGrannafa, Uppsala University


Organizing Committee
Dr. L.I. Feng, Jilin University, China
Dr. L. Cao, Jilin University, China
Dr. S.Y. Zhen, Jilin University, China
Dr. C. Xie, Wuhan University of Science and Technology, China
Dr. Q. Li, Wuhan University of Science and Technology, China
Ms. L.L. Chen, Wuhan Conference Technical Service Support Committee, China
Ms. M.G. Zhu, Wuhan Conference Technical Service Support Committee, China
Mr. Z.H. Yu, Wuhan Conference Technical Service Support Committee, China
Mr. M. Wang, Wuhan Conference Technical Service Support Committee, China
Mrs. Deng, Wuhan Hoffa Sande Academic Communication Co., Ltd., China






Key Information
Paper Submission

Submit by email

ichiac@126.com




Get the Template

Please Contact 

HIAC Organizing 

Committee Members




Contact

Teacher An

QQ: 1903502632

Teacher Ren

QQ: 3439067322

Important Dates

Submission Deadline: 

April 20, 2021

Registration Deadline: 

April 25, 2021

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